manual wire bonder

PDP Equipment Ltd offers fully refurbished Kulicke & Soffa (K&S) Manual Wire Bonders. Key benefits. 3 Months Parts & Labour warranty.

Innovative Industry-Leading Ball Bonding Solutions. Kulicke & Soffa's ball bonders are the leading generation of semiconductor assembly equipment for today's most challenging applications. With our long-standing tradition of innovation and technology leadership, the K&S ball bonders set new standards for performance, productivity, reliability

This catalog offers our wide range of workholders for standard and customized applications, suitable for use with all types of manual bonders (MPP and other suppliers). The MPP Manual Wire Bonder department continues to develop advanced workholders designed to fit our customer's specific application needs and requirements.

Manual Wire Bonders / Optional Die Bonder. Series 53 - Small, Manual, Easy; If you need 1 to 100 bonds per day; Complete, manual table top bonder 

A simple exchange of clamp assemblies, bond tool, and wire path provided with the software mode will allow conventional 45° wire feed, deep access wire or ribbon, ball bonding, insulated wire and single point tab / lead bonding. All programmed bond variables as well as machine settings for each bond mode are retained in the machines memory.

Motorized Tail Control; 4" TFT Display for Easy Control of all Bond Parameters; Simple Change between Ball Bonding and Wedge Bonding; Deep Access Bondhead 

WIRE BONDER for the development and production of microchips and DIE BONDER for placing microchips. Wire Bonder. HB05; HB10; HB16; HB100; HB30; Overview; Die Bonder. HB75; H80;

Description. Our HB05 gives you an easy access to the topic of bonding. Look, aim, bond - done. 4“ TFT Multibutton Display Fast Access to all parameters Our long tested 4“control panel provides you with an intuitive entry bonding with our product. All processes are visible for you at any time.

The Model 4526 Auto-Stepback Wedge Bonder is used with aluminum wire, gold wire and. ribbon. It is especially appropriate for your high quality applications requiring tight control of. wire

Model 7400D Series, Wedge-Wedge Wire Bonders, Manual X-Y-Z Overview Year 2000 saw the "C" Series finally replace the venerable "A" Series, and now witnesses the transition accepts the new tool assemblies of the wire bonders as well as other cast-body tool assemblies. The angled wedge wire bond configuration is shown below.

Model 676 is a thermosonic wedge bonder for use with gold wire & gold or aluminum ribbon. It is a deep-access, long-reach bonder. In some applications it can be used to bond copper, silver, palladium-silver and up to 1.5 mil platinum wire. Model 522A Ball Bonder. Model 522A is a manual thermosonic ball bonder for use with 0.7 to 2.0 mil gold wire.

CONVERTABILITY: WEST•BOND introduced the first triple convertible wire bonder back in November of 1969, today WEST•BOND introduces a new tool head that can bond it all: 45°

In , Micro Point Pro Ltd (MPP) acquired from Kulicke and Soffa the business unit that designs and manufactures Manual Wire Bonders for Universities, R&D centers, and small production applications. Since then MPP is a world OEM leader in the Manual Wire Bonders industry with our state-of-the-art products and excellent global support.

Global Manual Wire Bonders Market by Type (Ball-Wedge Manual Wire Bonders, Wedge-Wedge Manual Wire Bonders, Convertible Manual Wire Bonders), By Application (Integrated Device Manufacturers (IDMs), Outsourced Semiconductor Assembly and Test (OSAT)) And By Region (North America, Latin America, Europe, Asia Pacific and Middle East & Africa), Forecast From

We install extra-long bond arms/transducer in all our bonders. Further is the clamp and its screw installed on top of the tool instead of behind it. This unique combination is the key to access

Used manual wire bonder. Trusted Seller. Kluicke & Soffa 4526 Manual Wedge Bonder. USED. Manufacturer: Kulicke & Soffa; Model: 4526; Manufacturer Kulicke & Soffa Model 4526 Description Analog Manual Wedge Bonder - Leica GZ6 Microscope Accessories Heated Clamp Work Holder Leica GZ6 Microscope with 15X/15.6 eyepieces Other Information Wire diame

West Bond 7476D Manual Wire Bonder SOP . 4/29/2020. 2 Operation Tips: Figure 1. schematic of wedge bonding • Make sure that your package and dies are clean. Photoresist residue, fingerprints, acetone/alcohol residue, on any surface to be bonded will make bonding difficult or

The HB05 is a bench top size wire bonder, ideal for laboratories and pilot production lines. One bond head for bonding in ball/wedge or wedge/wedge bonding 

Feb 26,  · Our customers enjoy the added value that doing business with MPP – a company with over 40 years of wire bonding experience – provides. Including: Install base of 9000+

The MPP iBond5000 Wire Bonder series is based on the proven 4500 Series, the market leader for nearly a decade, and used mainly for Optoelectronic Modules, Hybrids/MCMs, Microwave Products, Discrete Devices/Lasers, Chip-on-Boards, Leads, Sensors, High Power Devices and much more.

F&S Bondtec offers the perfect development machine with its manual wire bonder. Simple operation, extremely adaptable bonding settings, at an unbeatable price-performance ratio. - Complete, manual table top bonder - Unbeatable price-to-performance ratio - Extremely adaptable bond settings, loop shapes, force and power profiles etc.

Wire bonders for ball and wedge bonding on the same machine. Gold, aluminum, copper, platinum wires and ribbons up to diameters of 75um or sections of 

Hesse Assist Tools: load cell, bondtool and wire spool detection, tool calibration without wedge gauge for operator independency. Outstanding features of the new Bondjet BJ985 are the large bonding area of 370 mm x 870 mm, a high drive through and high speed. Hesse , as technology leader, has designed the only heavy wire bondhead with a non

Fully automatic wird bonder with a huge work area Joining Technology Wire Bonding. Wedge-Wedge Fine Wire; Deep Access Wedge-Wedge Fine Wire; Wedge-Wedge Heavy Wire; Wedge

Kulicke & Soffa iBond5000 Manual Wire Bonder for wedge and ball bonding of: - Al wires (20-76 μm) - Au wires (12.7-76 μm) - ribbons (up to 25 x 250 μm) 

Manual “E”Series models are available for all microwave, semiconductor, R.F., and hybrid production, and are ideal for repair station or laboratory use. MODEL 7374E adapted for

Semi-Automatic & Manual Wire Bonders Fully Automatic Wire Bonders - with Exchangeable Bondheads. Series 56. Desktop Micro Factory Wire Bonder.

The HB05 series bench top wire bonder is easy to use and ideal for laboratories, pilot production runs and small scale production lines, configurable with a single bondhead for ball and wedge bonding. An intuitive user interface provides the user with access to all of the bond parameters and bonding recepies stored on the machine.

With over 30 years of wire bonding experience the current range of MPP manual wire bonder’s include the i5000B Ball Bonder, i5000W Wedge Bonder and i5000D Dual Bonder, which has both ball bonding and deep access wedge bonding capabilities. The equipment is used for process development, production or research of microelectronic and related

Wire Bonding Manual for the. Kulicke & Soffa Ltd. Dicing Systems Wire Bonder. Model 4526. Written by Dane Gentry and Mario Verduzco. This manual is intended 

4526 Manual Wedge Bonder with Analog Controls The system is extremely simple to set-up and for ease of use incorporates analog controls. More 4522 Manual Ball Bonder with Analog Controls Advanced bench-top manual gold ball wire bonder with operator initiated controls and analog adjustments. More 4523AD Wedge Bonder with digital controls