xilinx package drawings

Xilinx Heat Sink PQFP (HQ208/HQG208) Package Drawing Author: Xilinx, Inc. Subject: Package drawing of 208-Pin Heat Sink PQFP (HQ208/HQG208) Keywords: hq208, hqg208, 208 pin, heat sink, PQFP, package, mechanical drawing,

Zynq-7000 SoC Packaging and Pinout Product Specification (UG865) ug865-Zynq-7000-Pkg-Pinout.pdf Document_ID UG865 Release_Date 2021-07-28 Revision 1.9 English

Xilinx PQFP (PQ160/PQG160) Package Drawing Author: Xilinx, Inc. Subject: Package drawing of 160-Pin PQFP (PQ160/PQG160) Keywords: pq160, pqg160, 160 pin, PQFP, package,

Each Spartan-6 FPGA slice contains four LUTs and eight flip-flops. 3. Each DSP48A1 slice contains an 18 x 18 multiplier, an adder, and an accumulator. 4. Block RAMs are fundamentally 18 Kb in size. Each block can also be used as two independent 9 Kb blocks. 5. Each CMT contains two DCMs and one PLL. 6.

Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the 

Xilinx TQFP (TQ100/TQG100) Package Drawing, Drawing A 100.

324 Ball Chip-Scale BGA (CSG324) Package, 0.80 mm Pitch PK381 (v1.1) November 23, www.xilinx.com 2 Revision History The following table shows the revision history for this document. Notice of Disclaimer Xilinx regards this materials data to be correct but makes no guarantee as to its accuracy or

Note: The zip file includes ASCII package files in TXT format and in CSV format. The format of this file is described in UG475 . Product updates, events, and resources in your inbox

Virtex®-7 FPGA Package Files. Spartan®-6 FPGA Package Files. Kintex®-7 FPGA Package Files. Virtex®-5 FPGA Package Files. Artix®-7 FPGA Package Files. Virtex®-4 FPGA

Note: The zip file includes ASCII package files in TXT format and in CSV format. The format of this file is described in UG575 . Product updates, events, and resources in your inbox

Xilinx KINTEX-7 XC7K series Flip-chip BGA packaged in FFG676 with Lid. Pitch 1mm. Category. Electrical Components, Packages.

Added Figure 4-37 the mechanical drawing for the Kintex-7 devices FFG1156 package. Also added some Virtex-7 device mechanical drawings in 

2 www.xilinx.com PK088 (v1.1) August 27, 2007 Flip-Chip BGA (FF676) Package Revision History The following table shows the revision history for this document. Date Version Revision 4/10/06 1.0 Initial Xilinx release. 8/27/07 1.1 Corrected symbol typos (D/E, D1/E1).

Dec 15,  · Solution. BSC means "Basic Space Between Center". The "Drawing Requirements Manual" by Jerome Lieblich (W/C is in compliance with Mil Std 100F) defines

The package top-markings for the XC and XA Versal® devices are similar to the example shown in the following figure. Figure 1. LSVC4072 Package—VP1802 Pin Map; Mechanical Drawings; SFVA784 Mechanical—VE2202 and VE2302; Xilinx logo, Xilinx name with trademark,

Package names contain a single-character alphabetic designator followed by the exact number of pins found on the package. • VCCAUX_IO pins are not divided into bank groups. VCCAUX_IO must be connected to VCCAUX at the board level. • Internal logic is separated from I/O logic by the addition of the VCCINT_IO power pins.

Title: Plastic Flip-chip BGA (FF1148) Package Author: Xilinx, Inc. Subject: Plastic Flip-chip BGA (FF1148) Package Keywords: Xilinx, packaging, package, package

Package Drawings Package drawings are available online at the Package Drawings page on xilinx.com . Specifications and definitions Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or 0.100").

Jul 30,  · You can find packaging information in the "Device Packaging and Thermal Characteristics" guide at:

2 www.xilinx.com PK012 (v1.2.1) February 26, 2007 VQFP (VQ100/VQG100) Package Revision History The following table shows the revision history for this document. Date Version Revision 6/18/04 1.2 Xilinx Initial Release 2/26/07 1.2.1 Minor update to clarify Note #2.

Xilinx PLCC (PC84/PCG84) Package Drawing Author: Xilinx, Inc. Subject: Package drawing of 84-Pin PLCC (PC84/PCG84) Keywords: pc84, pcg84, 84 pin, PLCC, package, mechanical

2004 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at 

Xilinx Flip-Chip BGA (FF676) Package Drawing Author: Xilinx Inc. Subject: Package drawing for 676-Ball Flip-Chip BGA (FF676) Keywords: pk, 088, ff676, flip-chip, flip chip, bga, package,

Xilinx Fine-Pitch BGA (FG324/FGG324) Package Drawing Author: Xilinx, Inc. Subject: Package drawing of 324-Ball Fine-Pitch BGA, 1.00mm Pitch (FG324/FGG324) Keywords: fg324, fgg324, 324 ball, fine pitch, package, mechanical drawing, specification Created Date: 1/24/2000 9:44:00 AM

Xilinx Product Categories. Devices. Back. Devices. Explore Silicon Devices; ACAPs; FPGAs & 3D ICs; SoCs, MPSoCs, & RFSoCs; Cost-Optimized Portfolio; See All Package

Title: Xilinx PK224 1738 Ball Flip-Chip BGA (FF1738/FFG1738) Package, Package Drawing Author: Xilinx, Inc. Subject: FF1738 and FFG1738 package drawing

Thermal Packaging Management: Application Note XAPP415. 460 KB (v1.0) 12/19/01. Group. Package. Symbol. Package Description.

Diagrams and Chapter 5, Mechanical Drawings have updated tables and new The Xilinx® UltraScale™ architecture is the first ASIC-class All 

trademarks of Xilinx, Inc. All other trademarks are the property of their respective owners. PK081 (v1.1) December 15, 2008. Fine-Pitch (FG484/FGG484) BGA 

Xilinx Heat Sink PQFP (HQ208/HQG208) Package Drawing Author: Xilinx, Inc. Subject: Package drawing of 208-Pin Heat Sink PQFP (HQ208/HQG208) Keywords: hq208, hqg208, 208 pin, heat sink, PQFP, package, mechanical drawing, specification Created Date: 1/24/2000 9:44:00 AM

Xilinx TQFP (TQ100/TQG100) Package Drawing Author: Xilinx, Inc. Subject: Package drawing of 100-Pin TQFP (TQ100/TQG100) Keywords: tq100, tqg100, 100 pin, TQFP, package, mechanical drawing, specification Created Date: 1/24/2000 9:44:00 AM